Formation of the ‘Coating—Substrate’ Transient Diffusion Layer at Electrocrystallization

Eh. F. Shtapenko, V. O. Zabludovskiy, V. V. Dudkina

Dnipropetrovsk National University of Railway Transport named after Academician V. Lazaryan, 2 Lazaryana Str., 49010 Dnipropetrovsk, Ukraine

Received: 05.03.2013; final version - 20.08.2013. Download: PDF

The formation of transient diffusion layer at electrocrystallization in the transition ‘coating—substrate’ layer is considered. Results of the micro-X-ray spectral analysis show that depth of a diffusion layer at nickel electro-deposition on a copper substrate is equal to 1.5—3 $\mu$m at variation of cathodic potential from 0.1 to 0.3 V and is equal to 0.5—2 $\mu$m at zinc electrodeposition on a copper substrate at potential variation from 0.2 to 0.4 V. Within the scope of the model of not coinciding spheres in the elasticity theory, energies, which are necessary for introduction of the adsorbed atoms of nickel and zinc into a crystal lattice of a copper substrate, are calculated. As shown, for systems, which form solid Ni—Cu and Zn—Cu solutions, the energy required for embedding of nickel or zinc into the crystal lattice of the copper substrate is sufficient, but it is not sufficient to embed atoms into the crystal lattice of the tungsten substrate. It is confirmed by results of the micro-X-ray spectral analysis.

Key words: transient diffusion layer, cathode potential, electrocrystallization, solid solution, micro-X-ray spectral analysis.

URL: http://mfint.imp.kiev.ua/en/abstract/v36/i01/0039.html

DOI: https://doi.org/10.15407/mfint.36.01.0039

PACS: 61.72.S-, 68.35.Fx, 68.55.Ln, 81.15.-z, 81.65.-b, 81.70.Jb, 82.80.Pv

Citation: Eh. F. Shtapenko, V. O. Zabludovskiy, and V. V. Dudkina, Formation of the ‘Coating—Substrate’ Transient Diffusion Layer at Electrocrystallization, Metallofiz. Noveishie Tekhnol., 36, No. 1: 39—48 (2014) (in Russian)


REFERENCES
  1. N. A. Kostin, V. S. Kublanovskiy, V. A. Zabludovskiy, Impul'snyy Elektroliz (Kiev: Naukova Dumka: 1989) (in Russian).
  2. V. V. Povetkin, I. M. Kovenskiy, Struktura Elektroliticheskikh Pokrytiy (Moscow: Metallurgiya: 1989) (in Russian).
  3. G. Schulze, Metallofizika (Moscow: Mir: 1971) (in Russian translation).
  4. A. J. Bard and L. R. Faulkner, Electrochemical Methods. Fundamentals and Applications (New York: John Wiley and Sons: 2001).
  5. J. O'M. Bockris and A. K. N. Reddy, Modern Electrochemistry (New York: Kluwer Academic: 2002), vol. 1, 2.
  6. B. S. Bokshtein, Diffuziya v Metallakh (Moscow: Metallurgiya: 1978) (in Russian).
  7. B. A. Spiridonov and Yu. N. Shalimov, Sposob Polucheniya Prochnostseplennykh Pokrytiy na Osnove Nikelya na Metallicheskikh Detalyakh, Patent 2130091 Russia (C25D3/56) (Publ. 10.05.1999, Bul. No. 11) (in Russian).
  8. I. M. Kovenskiy, S. V. Skifskiy, and V. V. Povetkin, Sposob Polucheniya Prochnostseplennykh Gal'vanicheskikh Pokrytiy na Metallakh i Splavakh, Patent 2051205 Russia (C25D5/34) (Publ. 27.12.1995, Bul. No. 8) (in Russian).
  9. I. M. Kovenskii and V. V. Povetkin, J. Hyperfine Interactions, No. 52: 367 (1990). Crossref
  10. V. M. Fedosyuk, O. I. Kasyutich, Metallofiz. Noveishie Tekhnol., 19, No. 10: 42 (1997) (in Russian).
  11. Yu. P. Tarasenko, S. V. Pozdnyakov, V. G. Lyuttsau, Fizika i Khimiya Obrabotki Materialov, 4, No. 2: 97 (1991) (in Russian).
  12. A. E. Vol, Stroenie i Svoystva Dvoynykh Metallicheskikh Sistem (Moscow: MISiS: 1959) (in Russian).
  13. E. P. Shtapenko, Fizyka i Khimiya Tverdoho Tila, 8, No. 2: 422 (2007) (in Ukrainian).
  14. N. F. Mott and F. R. N. Nabarro, Proc. Phys. Soc., 52: 86 (1940). Crossref