Issues »  Volume 36, Issue 4

General Kinetics of the Cellular Decomposition of Cu—Ti Solid Solutions

T. S. Gatsenko, O. A. Shmatko

G.V. Kurdyumov Institute for Metal Physics, NAS of Ukraine, 36 Academician Vernadsky Blvd., UA-03680 Kyiv-142, Ukraine

Received: 27.03.2014. Download: PDF

Kinetic and thermodynamic parameters of cellular decomposition of supersaturated solid solutions in Cu—Ti alloys are investigated. Data of kinetic parameters of this process such as cells’ growth rate and interplate distance for copper alloys with 3.68, 4.0, 4.46, 4.98, 5.69, and 6.0 at.% Ti are generalized. Grain-boundary mobility and activation energy of migration of cellular reaction front are determined. Thermodynamic parameters of decomposition of supersaturated solid solutions of Ti in Cu (changes of free energy and entropy of grain-boundary migration) are calculated.

Key words: cellular decomposition, grain-boundary mobility, activation energy, entropy and free energy of grain boundary migration.

URL: http://mfint.imp.kiev.ua/en/abstract/v36/i04/0431.html

DOI: https://doi.org/10.15407/mfint.36.04.0431

PACS: 64.70.kd, 64.75.Nx, 66.30.Fq, 68.35.Fx, 81.05.Bx, 81.40.Cd

Citation: T. S. Gatsenko and O. A. Shmatko, General Kinetics of the Cellular Decomposition of Cu—Ti Solid Solutions, Metallofiz. Noveishie Tekhnol., 36, No. 4: 431—444 (2014) (in Ukrainian)

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