Issues »  Volume 36, Issue 8

Size Dependence of Mechanical Stresses in the Metal Condensates on Silicon

B. P. Koman$^{1}$, V. M. Yuzevych$^{2}$

$^{1}$Ivan Franko National University of Lviv, 50 Dragomanova Str., 79005 Lviv, Ukraine
$^{2}$Karpenko Physico-Mechanical Institute, NAS of Ukraine, 5, Naukova Str., 79060 Lviv, Ukraine

Received: 26.07.2013; final version - 29.01.2014. Download: PDF

This paper experimentally examines the external and internal size effects implemented in the internal (intrinsic) and thermal stresses of copper condensates on the silicon single-crystal substrates. The behaviours of maximum tension with changing film thickness and deposition rate are studied. Formation of internal stresses is caused by the position of the interfacial interaction in the condensate system—substrate and the very structure of the condensate. As shown, the process of condensation on the metal substrate is accompanied by a change in orientation of interfacial interaction energy parameters: interfacial energy, interfacial tension, adhesion-bonds’ energy, and work of adhesion at the nanocondensate stages (silicon surface—metallic nanocondensate) and continuous film (previous layer—next layer). The influence of the size dependence of film mechanical parameters on the thermal component of mechanical stress is investigated.

Key words: mechanical stresses, interfacial interaction, nanocondensate.

URL: http://mfint.imp.kiev.ua/en/abstract/v36/i08/1113.html

DOI: https://doi.org/10.15407/mfint.36.08.1113

PACS: 68.35.bd, 68.35.Gy, 68.35.Md, 68.35.Np, 68.55.J-, 81.07.Bc, 81.15.Gh

Citation: B. P. Koman and V. M. Yuzevych, Size Dependence of Mechanical Stresses in the Metal Condensates on Silicon, Metallofiz. Noveishie Tekhnol., 36, No. 8: 1113—1128 (2014) (in Ukrainian)

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