Growth of Through Pores and Thermal Dispersion of Continuous Polycrystalline Films of Copper
S. I. Petrushenko, S. V. Dukarov, V. N. Sukhov
V.N. Karazin Kharkiv National University, 4 Svobody Sq., 61022 Kharkiv, Ukraine
Received: 16.08.2016. Download: PDF
The results of studies of dispersion of continuous polycrystalline films of copper onto the islands under the influence of temperature are presented. As found, the previous annealing of films at the temperature of 150°C increases their thermal stability. The observed effect can be explained by the change in the microstructure of films during the annealing process. The activation energy of surface self-diffusion in copper films is determined using electron-microscopy studies of the kinetics of through-pores’ growth while heating.
Key words: thermal stability, activation energy, surface self-diffusion, copper thin films.
URL: http://mfint.imp.kiev.ua/en/abstract/v38/i10/1351.html
DOI: https://doi.org/10.15407/mfint.38.10.1351
PACS: 61.43.Gt, 66.30.Fq, 66.30.Pa, 68.35.Dv, 68.55.J-, 68.60.Dv, 72.10.Fk, 73.61.At
Citation: S. I. Petrushenko, S. V. Dukarov, and V. N. Sukhov, Growth of Through Pores and Thermal Dispersion of Continuous Polycrystalline Films of Copper, Metallofiz. Noveishie Tekhnol., 38, No. 10: 1351—1366 (2016) (in Ukrainian)