Impact Structural-Impurity State on the Electrophysical Properties of Fe/$n$-Si Junction

V. O. Burlakov, Ye. I. Bogdanov, O. V. Filatov, O. E. Pogorelov, S. Ye. Bogdanov

G. V. Kurdyumov Institute for Metal Physics, NAS of Ukraine, 36 Academician Vernadsky Blvd., UA-03142 Kyiv, Ukraine

Received: 12.06.2023; final version - 01.09.2023. Download: PDF

The paper presents the results of study of the electrophysical properties of metal–semiconductor junctions, where the influence of the structural-impurity state of the semiconductor substrate and deposited film is significant. The influence of different preparing modes for the silicon substrate, including the thermal gettering treatment, on minority charge-carrier lifetime and on the concentration of electrically active impurity defects in the surface layer of $n$-Si is considered. The calculation results of the $I$–$V$ characteristics of Fe/$n$-Si and (Fe + C)/$n$-Si junctions are presented with the proposed method for the quantification of their rectifying capabilities. The influence of the Fe film surface oxide and its alloying with carbon on the rectifying capability of the Fe/$n$-Si junctions is shown. The decreasing of the rectifying capability of the (Fe + C)/$n$-Si junction is established using the unique method for measuring the electrophysical properties of thin-film junction under conditions of an increase in external mechanical load.

Key words: metal-semiconductor, rectifying junction, heat treatment, gettering, precipitates, structural-impurity state.

URL: https://mfint.imp.kiev.ua/en/abstract/v45/i12/1401.html

DOI: https://doi.org/10.15407/mfint.45.12.1401

PACS: 61.72.Ff, 61.72.Yx, 73.40.Qv, 81.30.Mh, 81.40.Rs, 81.70.Ex, 85.40.-e

Citation: V. O. Burlakov, Ye. I. Bogdanov, O. V. Filatov, O. E. Pogorelov, and S. Ye. Bogdanov, Impact Structural-Impurity State on the Electrophysical Properties of Fe/$n$-Si Junction, Metallofiz. Noveishie Tekhnol., 45, No. 12: 1401—1412 (2023) (in Ukrainian)


REFERENCES
  1. N. A. Al-Ahmadi, Mater. Res. Express, 7, No. 3: 032001 (2020). Crossref
  2. M. Higashiwaki, K. Sasaki, A. Kuramata, T. Masui, and S. Yamakoshi, Appl. Phys. Lett., 100: 013504 (2012). Crossref
  3. W. Kou, S. Liang, H. Zhou, Y. Dong, S. Gong, Z. Yang, and H. Zeng, Chin. J. Electron., 31: 467 (2022). Crossref
  4. H. I. Hussein, A. H. Shaban, and I. H. Khudayer, Energy Proc., 157: 150 (2019). Crossref
  5. N. Lebedeva and P. Kuivalainen, J. Appl. Phys., 93: 9845 (2003). Crossref
  6. M. Holub and P. Bhattacharya, J. Phys. D: Appl. Phys., 40: R179 (2007). Crossref
  7. V. O. Burlakov, O. Ye. Pohorelov, and O. V. Filatov, Metallofiz. Noveishie Tekhnol., 42, No. 9: 1207 (2020) (in Ukrainian). Crossref
  8. J. Czochralski, Zeitschrift für Physikalische Chemie, 92U, Iss. 1: 219 (1918). Crossref
  9. R. G. Rhodes, Imperfections and Active Centres in Semiconductors (Oxford-London: Pergamon Press: 1964).
  10. K. V. Ravi, Imperfections and Impurities in Semiconductor Silicon (New York: Wiley: 1981).
  11. T. Y. Tan, E. E. Gardner, and K. W. Tice, Appl. Phys. Lett., 30: 175 (1977). Crossref
  12. Ya. Tarui, Osnovy Tekhnologii Sverkhbol'shikh Integral'nykh Skhem [Base of Very Large Integrated Circuits Technology] (Moskva: Radio i Svyaz': 1985) (Russian translation).
  13. I. V. Kutovoy, B. K. Shurduk, M. D. Zhivov, and E. I. Bogdanov, Proc. IV Vsesoyuznoy Konferentsii Analiticheskikh Metodov Issledovaniya Ehlektronnoy Tekhniki (Chișinău: 1991), p. 109 (in Russian).
  14. K. Sangwal, Etching of Crystals. Theory, Experiment and Application (Amsterdam: North-Holland: 1987).
  15. S. M. Sze, VLSI Technology (New York: McGraw-Hill Book Company: 1983).
  16. V. B. Molodkin, A. I. Nizkova, S. I. Olikhovskii, I. A. Moskovka, E. I. Bogdanov, S. E. Bogdanov, M. M. Belova, S. V. Dmitriev, V. M. Popov, and I. I. Rudnitskaya, Metallofiz. Noveishie Tekhnol., 28, No. 5: 601 (2006) (in Russian).
  17. U. Goesele, P. Laveant, R. Scholz, N. Engler, and P. Werner, MRS Online Proceedings Library, 610: 711 (1999). Crossref
  18. S. N. Tewari and J. R. Cost, J. Mater. Sci., 17, No. 6: 1639 (1982). Crossref
  19. E. H. Rhoderick and R. H. Williams, Metal-Semiconductor Contacts (Oxford: Clarendon Press: 1988).
  20. S. M. Sze, Physics of Semiconductor Devices (Wiley: New York: 1981).
  21. H. Dawczak-Dębicki, A. Marczyńska, A. Rogowska, M. Wachowiak, M. Nowicki, S. Pacanowski, B. Jabłoński, W. Kowalski, J. Grembowski, R. Czajka, and L. Smardz, Acta Phys. Pol., 132, No. 4: 1272 (2017). Crossref
  22. H. K. Bowen, D. Adler, and B. H. Auker, J. Solid State Chem., 12: 355 (1975). Crossref
  23. S. S. Shinde, R. A. Bansode, C. H. Bhosale, and K. Y. Rajpure, J. Semicond., 32: 013001 (2011). Crossref
  24. V. O. Burlakov, O. Ye. Pohorelov, and O. V. Filatov, Metallofiz. Noveishie Tekhnol., 45, No. 2: 157 (2023) (in Ukrainian). Crossref