Выпуски МФиНТ »  Том 46, выпуск 2

Evolution of Copper Microstructure Subjected to Combined Twisting and Drawing Technology

A. V. Volokitin, T. D. Fedorova, A. I. Denissova

Карагандинский индустриальный университет, просп. Республики, 30, 101400 Темиртау, Республика Казахстан

Получена: 10.10.2023; окончательный вариант - 15.11.2023. Скачать: PDF

This work studies evolution of copper microstructure during a combined deformation process. The essence of this process is in deformation of copper wire in a rotating equal-channel stepped matrix with subsequent drawing. Deformed wire is examined using transmission electron microscopy and EBSD analysis. After three cycles of deformation, an ultrafine-grained gradient microstructure with a high component of high-angle grain boundaries is obtained.

Ключевые слова: copper, wire, twisting, drawing, microstructure.

URL: https://mfint.imp.kiev.ua/ru/abstract/v46/i02/0121.html

PACS: 46.80.+j, 62.20.F-, 62.40.+i, 81.20.Hy, 81.20.Wk, 81.40.Lm, 83.50.Uv

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