Issues »  Volume 36, Issue 4

Kinetics of Dispersion—Coagulation at Annealing of Metal Nanofilms Deposited on the Surface of Non-Metallic Materials

Yu. V. Naydich, I. I. Gab, T. V. Stetsyuk, B. D. Kostyuk

I.M. Frantsevich Institute for Problems of Materials Sciences, NAS of Ukraine, 3 Academician Krzhizhanovskoho Str., UA-03680 Kyiv-142, Ukraine

Received: 28.11.2013. Download: PDF

Kinetics of dispergation—coagulation processes of various metal (Ag, Au, Cu, Nb, Hf) nanofilms of 100 nm thickness, which are deposited onto oxide and nonoxide substrates and are annealed in a wide range of temperatures from 600 up to 1600°C, is investigated. The explanation of metal-nanofilm decomposition mechanism with regard to the processes occurring in film—solid base interphase boundary is proposed.

Key words: kinetics of dispersion and coagulation, annealing, nanofilms.

URL: http://mfint.imp.kiev.ua/en/abstract/v36/i04/0519.html

DOI: https://doi.org/10.15407/mfint.36.04.0519

PACS: 68.08.Bc, 68.35.Np, 68.37.Hk, 68.37.Ps, 68.55.-a, 81.15.Jj, 82.70.-y

Citation: Yu. V. Naydich, I. I. Gab, T. V. Stetsyuk, and B. D. Kostyuk, Kinetics of Dispersion—Coagulation at Annealing of Metal Nanofilms Deposited on the Surface of Non-Metallic Materials, Metallofiz. Noveishie Tekhnol., 36, No. 4: 519—530 (2014) (in Russian)

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