Issues »  Volume 39, Issue 8

Supercooling During a Crystallization of Thin Layers of the Bi + 7% wt. Sn Alloy Being Contact to Crystalline Copper

S. V. Dukarov$^{1}$, S. I. Petrushenko$^{1}$, V. M. Sukhov$^{1}$, R. I. Bihun$^{2}$, Z. V. Stasyuk$^{2}$, D. S. Leonov$^{3}$

$^{1}$V.N. Karazin Kharkiv National University, 4 Svobody Sqr., 61022 Kharkiv, Ukraine
$^{2}$Ivan Franko National University of Lviv, 1 Universytetska Str., UA-79000 Lviv, Ukraine
$^{3}$Technical Centre, NAS of Ukraine, 13 Pokrovs’ka Str., 04070 Kyiv, Ukraine

Received: 15.07.2017. Download: PDF

The results of studies of supercooling of the Bi + 7% wt. Sn alloy in multi-layer Cu/Bi/Sn films are presented. The crystallization temperature is determined by direct $in situ$ electron diffraction methods during heating and cooling of the samples. Effects of the distinctions in conditions of samples’ fabrication on both the temperature of supercooling of a low-melting alloy and the pattern of its crystallization are revealed. Annealing of Cu/Bi films at 300°C for 5 minutes, performed before the deposition of the tin layer, increases the supercooling value from 65 K to 140 K. Additionally, because of intermediate annealing, crystallization becomes diffusive instead of avalanche-like one, and crystallization period stretches to a 20 K interval. This is due to the dispersion of the pre-annealed samples that occurs in the first heating cycle of Cu/(Bi + 7% wt. Sn) films.

Key words: supercooling of alloys, multilayer films, condensation conditions, thermal effect.

URL: http://mfint.imp.kiev.ua/en/abstract/v39/i08/1069.html

DOI: https://doi.org/10.15407/mfint.39.08.1069

PACS: 64.70.D-, 64.70.kd, 68.35.Dv, 68.37.-d, 68.55.J-, 73.61.At, 81.15.Ef, 81.40.Ef

Citation: S. V. Dukarov, S. I. Petrushenko, V. M. Sukhov, R. I. Bihun, Z. V. Stasyuk, and D. S. Leonov, Supercooling During a Crystallization of Thin Layers of the Bi + 7% wt. Sn Alloy Being Contact to Crystalline Copper, Metallofiz. Noveishie Tekhnol., 39, No. 8: 1069—1086 (2017) (in Russian)

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