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Issues »  Volume 39, Issue 8

Supercooling During a Crystallization of Thin Layers of the Bi + 7% wt. Sn Alloy Being Contact to Crystalline Copper

S. V. Dukarov1, S. I. Petrushenko1, V. M. Sukhov1, R. I. Bihun2, Z. V. Stasyuk2, D. S. Leonov3

1V.N. Karazin Kharkiv National University, 4 Svobody Sqr., 61022 Kharkiv, Ukraine
2Ivan Franko National University of Lviv, 1 Universytetska Str., UA-79000 Lviv, Ukraine
3Technical Centre, NAS of Ukraine, 13 Pokrovs’ka Str., 04070 Kyiv, Ukraine

Received: 15.07.2017. Download: PDF

The results of studies of supercooling of the Bi + 7% wt. Sn alloy in multi-layer Cu/Bi/Sn films are presented. The crystallization temperature is determined by direct insitu electron diffraction methods during heating and cooling of the samples. Effects of the distinctions in conditions of samples’ fabrication on both the temperature of supercooling of a low-melting alloy and the pattern of its crystallization are revealed. Annealing of Cu/Bi films at 300°C for 5 minutes, performed before the deposition of the tin layer, increases the supercooling value from 65 K to 140 K. Additionally, because of intermediate annealing, crystallization becomes diffusive instead of avalanche-like one, and crystallization period stretches to a 20 K interval. This is due to the dispersion of the pre-annealed samples that occurs in the first heating cycle of Cu/(Bi + 7% wt. Sn) films.

Key words: supercooling of alloys, multilayer films, condensation conditions, thermal effect.

URL: http://mfint.imp.kiev.ua/en/abstract/v39/i08/1069.html

DOI: https://doi.org/10.15407/mfint.39.08.1069

PACS: 64.70.D-, 64.70.kd, 68.35.Dv, 68.37.-d, 68.55.J-, 73.61.At, 81.15.Ef, 81.40.Ef

Citation: S. V. Dukarov, S. I. Petrushenko, V. M. Sukhov, R. I. Bihun, Z. V. Stasyuk, and D. S. Leonov, Supercooling During a Crystallization of Thin Layers of the Bi + 7% wt. Sn Alloy Being Contact to Crystalline Copper, Metallofiz. Noveishie Tekhnol., 39, No. 8: 1069—1086 (2017) (in Russian)

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